Surface mount manufacturing line

Surface Mount Assembly

Prior to producing a product for the first time, parts are cataloged and loaded on feeders to be mounted on the prep machines. The screens used for applying solder paste to the raw PCB (printed circuit board) are checked for accuracy.

The "Pick and Place" machine, which is responsible for placing the surface mount components in their correct locations on the PCB, is programmed with the numeric coordinate data for every part.

The reflow oven, which heats the solder paste to the melting point, is programmed with a multistage profile that corresponds to the size and thermal mass of the product.

After the setup is verified the process is literally push the button and watch.

In many cases designs require the use of mixed technology, that is, the use of both surface mount components and thru-hole on the same PCB. Haller's processes allow with ease the production of mixed technology designs.